Invitation to INTERMOLD 2008

April 10, 2008

Mitsubishi Materials Corporation will take part in the 19th Japan International Die & Mold Manufacturing Technology Exhibition (INTERMOLD 2008).
Mitsubishi Materials looks forward to meeting you at Mitsubishi booth.

The 19th Japan International Die & Mold Manufacturing Technology Exhibition

	Period:	April 17 (Thu) - April 20 (Sun), 2008
	Hours:	10:00 - 17:00(10:00 - 16:00 on April 20, last day of exhibition)
	Venue:	INTEX OSAKA(International Exhibition Center, Osaka) »Access
	Booth:	Building 6B, Booth no. 6B-605

INTERMOLD2008 Web site

Features

Mitsubishi Materials will exhibit the latest cutting tools for applications based on the theme of providing all-round machining solutions for the die and mould industry.
Technical presentations will be made at the Mitsubishi booth throughout each day of INTERMOLD.
Theme A: Proposal for next generation direct milling
Theme B: Proposal for high efficiency, precision machining

Pre-Registration

You can pre-register for entrance to INTERMOLD 2008 at the following address. http://www.itp.gr.jp/im/english/visitor/registration.html

Deadline for entrance registration: 3:50 pm, April 20 (Sun), last day of exhibition

TOP

BACK